Abstract
Arsenic- and antimony-implanted silicon wafers have been annealed by a cw Ar ion laser. Glancing-angle Rutherford backscattering and transmission electron and optical microscopy measurements indicate that the mechanism for recrystallization is one of thermal solid-phase regrowth from the underlying crystalline-amorphous interface. No implant redistribution is observed.
Original language | English (US) |
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Pages (from-to) | 542-544 |
Number of pages | 3 |
Journal | Applied Physics Letters |
Volume | 33 |
Issue number | 6 |
DOIs | |
State | Published - 1978 |
Externally published | Yes |
ASJC Scopus subject areas
- Physics and Astronomy (miscellaneous)